Mechanic No Clean BGA Tin Solder Flux Paste MCN-UV80
Mechanic No Clean BGA Tin Solder Flux Paste is high bond strength and PH value-neutral. MCN-UV80 welding flux paste’s insulation is strong with a welding surface smooth. This rosin soldering flux paste is the best for IC and PCB for no corrosive. This mechanic flux paste has a boiling point only slightly higher than the melting point of the solder. The MECHANIC paste is for mobile phones, PC cards, and other sophisticated electronic chip-level help welding.
Features Of MCNUV80 Rosin Flux Paste Soldering Grease for BGA PGA SMD Repairing Work:
- 100% brand new and high quality.
- High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.
- PH value neutral, insulation is strong, welding surface smooth.
- Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.
- Its boiling point is only slightly higher than the melting point of the solder.
- Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding, and so on.
- Good soldering and welding tools.
- IC and PCB for no corrosive
- Super compacity: Applicable to PCB, BGA, SMD, PGA repair, Soldering, etc.
- Rosin-based Solder Paste.
Specifications Of MECHANIC Highly Synthetic Halogen-Free BGA Electric Welding Flux:
- Material: Plastic+ Rosin-based solder paste
- Size: 80g
- Type: Rosin-based BGA solder flux cream
- Viscosity: 0.2Pas
- Granularity: 0.22um
- Application: for Phone BGA Board Soldering Fixing
- Function: PC Cards Electronic Chip-level Welding
- 1 x Tin Soldering Flux Paste MCN-UV80